{"id":27,"date":"2021-06-08T21:31:00","date_gmt":"2021-06-08T12:31:00","guid":{"rendered":"http:\/\/grp.tcu.ac.jp\/flexelectronlab\/?p=27"},"modified":"2023-05-25T15:51:03","modified_gmt":"2023-05-25T06:51:03","slug":"research","status":"publish","type":"post","link":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/2021\/06\/08\/research\/","title":{"rendered":"Research"},"content":{"rendered":"

\"\"<\/p>\n

Society 5.0 and the Internet of Things (IoT)\u00a0<\/span><\/strong><\/p>\n

With the prevalence of the Internet of Things (IoT), there is increasing interest in using flexible electronics to realize wireless sensing and powering applications. The scope of this research group is on flexible electronics and their applications in different areas including high frequency, sensing and energy harvesting. This includes the design and simulation of high frequency passives and interconnects, device programming, the design and packaging of antennas for RFID applications, the investigation of different printing technologies to realize flexible electronics devices as well as the dielectric characterization of substrates for high frequency applications.<\/p>\n

\"\"<\/p>\n

Design and simulation of high frequency interconnects for semiconductor packaging<\/strong>
\nOn the other hand, to support the information technology era, there is a need for higher performing servers and computers. As such, there is a demand for multi-functional, compact, low power consumption and high speed processes. The semiconductor industry is looking at various chiplet technologies (2.5D, 3D packaging integration) towards this goal. This is also a key research theme in this laboratory, where we aim to optimize the interconnection of thin and flexible 3D packages based on packaging technology through simulation in order to achieve high density semiconductor devices.<\/p>\n

The overarching goal of the research in this laboratory is towards enabling an IoT society through the widespread adoption of flexible electronics. To achieve this, the utilization of AI and big data technologies is also considered towards realizing a smart society.<\/p>\n

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Society 5.0 and the Internet of Things (IoT)\u00a0 With the prevalence of the Internet of Things (IoT), there is in … Continue Reading →<\/a><\/p>\n","protected":false},"author":126,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":"","_locale":"ja","_original_post":"http:\/\/grp.tcu.ac.jp\/flexelectronlab\/?p=27"},"categories":[7],"tags":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/posts\/27"}],"collection":[{"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/users\/126"}],"replies":[{"embeddable":true,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/comments?post=27"}],"version-history":[{"count":0,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/posts\/27\/revisions"}],"wp:attachment":[{"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/media?parent=27"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/categories?post=27"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/tags?post=27"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}