{"id":29,"date":"2021-06-08T21:31:45","date_gmt":"2021-06-08T12:31:45","guid":{"rendered":"http:\/\/grp.tcu.ac.jp\/flexelectronlab\/?p=29"},"modified":"2023-08-02T10:25:00","modified_gmt":"2023-08-02T01:25:00","slug":"key-publications","status":"publish","type":"post","link":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/2021\/06\/08\/key-publications\/","title":{"rendered":"Key publications"},"content":{"rendered":"

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  1. S Jimkeli Singh, Ying Ying Lim, Jehova Jire L Hmar, P Chinnamuthu, \u201cTemperature dependency on Ce-doped CuO nanoparticles: a comparative study via XRD line broadening analysis\u201d, Appl. Phys. A,<\/em> 128, 188 (2022); https:\/\/doi.org\/10.1007\/s00339-022-05334-1<\/a><\/li>\n
  2. H. Manas Singh, Ying Ying Lim, P. Chinnamuthu, \u201cElectrical and dielectric parameters in TiO2-NW\/Ge-NW heterostructure MOS device synthesized by glancing angle deposition technique\u201d,
    \nSci. Rep<\/em>, 11, 19837 (2021);     https:\/\/doi.org\/10.1038\/s41598-021-99354-1<\/a><\/li>\n
  3. Ying Ying Lim, Yuichi Kimura<\/span>,\u00a0Martial David Hardy,<\/span> Shun Watanabe, Jun Takeya, \u201cThin and Flexible Printed Antenna Designed for Curved Metal Surfaces\u201d, Flexible Printed Electron<\/em>, 6(4), 045001 (2021); https:\/\/doi.org\/10.1088\/2058-8585\/ac2989<\/a><\/li>\n
  4. Shohei Kumagai, Akifumi Yamamura, Tatsuyuki Makita, Junto Tsurumi, Ying Ying Lim, Takahiro Wakimoto, Nobuaki Isahaya, Han Nozawa, Kayoko Sato, Masato Mitani, Toshihiro Okamoto, Shun Watanabe, Jun Takeya, \u201cScalable fabrication of organic single-crystalline wafers for reproducible TFT arrays\u201d, Sci. Rep<\/em>, 9, 15897, 1-8 (2019); https:\/\/doi.org\/10.1038\/s41598-019-50294-x<\/li>\n
  5. Ying Ying Lim, Hiroshi Nakagawa, Masaru Hashino, Masahiro Aoyagi, Katsuya Kikuchi, \u201cHardness characteristics of Au cone-shaped bumps targeted for 3-D packaging applications\u201d IEEE Trans. Compon. Packag. Manuf. Technol<\/em>., 9(3), 419-426 (2019); 10.1109\/TCPMT.2019.289323<\/li>\n
  6. Ying Ying Lim, Yee Mey Goh, Manabu Yoshida, Tung Thanh Bui, Masahiro Aoyagi, Changqing Liu, \u201c30-GHz high-frequency application of screen printed interconnects on an organic substrate\u201d, IEEE Trans. Compon. Packag. Manuf. Technol.<\/em>, 7(9), 1506-1515 (2017); 10.1109\/TCPMT.2017.2718023<\/li>\n
  7. Ying Ying Lim, Yee Mey Goh, Changqing Liu, David Hutt, \u201cSurface modification of an ambient UV-cured dielectric to realise electrically conducting traces\u201d, Surf. Coat. Technol<\/em>., 266, 93-104 (2015); https:\/\/doi.org\/10.1016\/j.surfcoat.2015.02.021<\/li>\n
  8. Ying Ying Lim, Yee Mey Goh, Changqing Liu, \u201cSurface treatments for inkjet printing onto a PTFE-based substrate for high frequency applications\u201d, Ind. Eng. Chem. Res.<\/em>, 52 (33), 11564-11574 (2013); https:\/\/doi.org\/10.1021\/ie4006639<\/li>\n
  9. Bangtao Chen, Vasarla Nagendra Sekhar, Cheng Jin, Ying Ying Lim, Justin See Toh, Sanchitha Fernando, Jaibir Sharma, \u201cLow-loss broadband package platform with surface passivation and TSV for wafer-level packaging of RF-MEMS devices\u201d, IEEE Trans. Compon. Packag. Manuf. Technol.<\/em>, 3(9), 1443 \u2013 1452 (2013); 10.1109\/TCPMT.2013.2263932<\/li>\n
  10. Vempati Srinivas Rao, Vasarla Nagendra Sekhar, Ho Soon Wee, Ranjan Rajoo, Gaurav Sharma, Lim Ying Ying, Pinjala Damaruganath, \u201cProcess and reliability of embedded micro-wafer-level package (EMWLP) using low cure temperature dielectric material\u201d, IEEE Trans. Compon. Packag. Manuf. Technol<\/em>., 2(1), 13-22 (2012); 10.1109\/TCPMT.2010.2104324<\/li>\n
  11. Ying Ying Lim, Xianghua Xiao, Srinivasa Rao Vempati, Nandar Su, Aditya Kumar, Gaurav Sharma, Teck Guan Lim, Kripesh Vaidyanathan, Jinglin Shi, John H. Lau, Shiguo Liu, \u201cHigh quality and low loss millimeter wave passives demonstrated to 77-GHz for SiP technologies using embedded wafer level packaging platform (EMWLP)”, IEEE Trans. Adv. Packag<\/em>., 33 (4),1061-1071 (2010). 10.1109\/TADVP.2010.2058849.<\/li>\n
  12. Mihai Dragos Rotaru, Lim Ying Ying, Haridas Kuruveettil, Yang Rui, Alexander P. Popov, Chua Chee-Parng, \u201cImplementation of packaged integrated antenna with embedded front end for bluetooth applications\u201d, IEEE Trans. Adv. Packag<\/em>., 31(3), 558-567 (2008); 10.1109\/TADVP.2008.927840.<\/li>\n
  13. Ying Ying Lim, Mihai Dragos Rotaru, Arokiaswami Alphones, Alexander P. Popov, \u201cSimple and improved extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique\u201d, IEE Proc. Microwaves, Antennas Propag.<\/em>, 152 (4), 214 \u2013 220 (2005); 10.1049\/ip-map:20045106.<\/li>\n<\/ol>\n

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    1. Stacy A Lynrah, Rajshree Rajkumari, Ying Ying Lim, P Chinnamuthu,\u201cUltraviolet Induced Hydrophilicity of Metal Nanoparticles Decorated MnO2 NWs for Self-Cleaning Applications\u201d,
      \n7th International Conference on Nanoscience and Nanotechnology (ICONN 2023), March 2023.<\/li>\n
    2. \u68ee\u672c \u9065, \u30ea\u30e0 \u30a4\u30f3\u30a4\u30f3,\u6850\u751f \u662d\u543e, \u201c\u30d8\u30eb\u30b9\u30b1\u30a2\u7528\u9014\u3092\u5bfe\u8c61\u3068\u3057\u305f\u30ea\u30c3\u30c4\u7dda\u306e\u30a4\u30f3\u30c0\u30af\u30bf\u30f3\u30b9\u8a55\u4fa1\u201d , \u00a0\u7b2c37\u56de\u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\u5b9f\u88c5\u5b66\u4f1a\u6625\u5b63\u8b1b\u6f14\u5927\u4f1a, 2023.<\/li>\n
    3. Ying Ying Lim, Masaru Hashino, Hiroshi Nakagawa, Masahiro Aoyagi, Katsuya Kikuchi, \u201cProcess evaluation of pyramidal and cone-shaped nanoparticle deposition (NPD) bumps using a thermally resistant resist\u201d, Proc. of International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), pp. 136-140, April 2018.<\/li>\n
    4. Ying Ying Lim, Masahiro Aoyagi, Yee Mey Goh, Changqing Liu, \u201cHigh frequency performance characterization of super-fine inkjet printed silver traces\u201d, Proc. IEEE CPMT Symposium Japan (ICSJ), pp. 239-242, November 2016.<\/li>\n
    5. Ying Ying Lim, Yee Mey Goh, Manabu Yoshida, Tung Thanh Bui, Tracey Vincent, Masahiro Aoyagi, Changqing Liu, \u201cSilver screen printed transmission lines – Analyzing the influence of substrate roughness on the RF performance up to 30 GHz\u201d, Proc. of IEEE 16th Electronics Packaging Technology Conference (EPTC), pp. 22-26, December 2014.<\/li>\n
    6. Ying Ying Lim, Yee Mey Goh, Hiroki Tsuda, Jun Akedo, Masahiro Aoyagi and Changqing Liu, \u201cAdhesion of aerosol deposition traces targeted for flexible electronics applications\u201d, Proc. of the Third International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D), August 2014.<\/li>\n
    7. Ying Ying Lim, Yee Mey Goh, Changqing Liu, \u201cRF performance of inkjet and stencil printed traces for flexible electronics applications, Proc. of IEEE 14th Electronics Packaging Technology Conference (EPTC), pp. 556-562, December 2012<\/li>\n
    8. Lim Ying Ying, David Ho Soon Wee, Kim Hyoung Joon, Pinjala Damaruganath, \u201cLow cost characterization of the electrical properties of thin film and mold compound for embedded wafer level packaging (EMWLP)\u201d, Proc. of IEEE 13th Electronics Packaging Technology Conference (EPTC), pp. 401-405, December 2011.<\/li>\n
    9. Ying Ying Lim, Bangtao Chen, Aibin Yu, Jinglin Shi, \u201cA broadband 3D package for RF MEMS devices utilizing through silicon vias (TSVs)\u201d, Proc. of 16th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), pp. 406-409, June 2011.<\/li>\n
    10. Lim Ying Ying Lim, Ho Soon Wee David, Chong Ser Choong, Myo Ei Pa Pa, Lim Teck Guan, \u201cA novel compact antenna with a low profile demonstrated on embedded wafer level packaging (EMWLP) technology\u201d, Proc. of IEEE 61st Electronic Components and Technology Conference (ECTC), pp. 681-686, May-June 2011.<\/li>\n
    11. Ying Ying Lim, Ranjan Rajoo, Ser Choong Chong, \u201cDesign and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance\u201d, Proc. of IEEE 12th Electronics Packaging Technology Conference (EPTC), Singapore, pp. 681-686, December 2010.<\/li>\n
    12. Ying Ying Lim, Aibin Yu, Bangtao Chen, \u201cWideband transitions for wafer level MEMS packages\u201d, Proc. IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), pp. 1-5, December 2010.<\/li>\n
    13. Lim Ying Ying, Nandar Su, David Ho Soon Wee, Phyo Phyo Thaw, Orson Wang, Hijiri Kuriyama, Shun Yokotsuka, Kenichi Shirashi, \u201cMillimeter wave dielectric characterization & demonstration of high-Q passives using a low loss thin film material\u201d, Proc. of IEEE 11th Electronics Packaging Technology Conference (EPTC), pp. 518-523, December 2009.<\/li>\n
    14. Ying Ying Lim, Srinivasa Rao Vempati, Nandar Su, Xianghua Xiao, Jinchang Zhou, Aditya Kumar, Phyo Phyo Thaw, Gaurav Sharma, Teck Guan Lim, Shiguo Liu, Kripesh Vaidyanathan, John H. Lau, \u201cDemonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform\u201d, Proc. IEEE 59th Electronic Components and Technology Conference (ECTC), pp. 508-515, May 2009.<\/li>\n
    15. Lim Ying Ying, Mihai Dragos Rotaru, \u201cA compact and low cost multilayered balun designed for SiP applications\u201d, Proc. of IEEE 8th Electronics Packaging Technology Conference (EPTC), pp. 82-84, December 2006.<\/li>\n
    16. Lim Ying Ying, Mihai Dragos Rotaru, \u201cAn integrated and compact ISM bandpass filter using combline structures\u201d, Proc. of IEEE 7th Electronics Packaging Technology Conference (EPTC), pp. 19-22, December 2005.<\/li>\n
    17. Lim Ying Ying, Mihai Dragons Rotaru, Arokiaswami Alphones, Alexander P. Popov, Ranjan Rajoo, \u201cA model for efficient and improved measurements of the complex permittivity of organic packaging materials using open-ended coaxial line technique\u201d, Proc. of IEEE 7th Electronics Packaging Technology Conference (EPTC), pp. 421-426, December 2005.<\/li>\n
    18. Lim Ying Ying, Mihai Dragons Rotaru, Arokiaswami Alphones, Alexander P. Popov and Ranjan Rajoo, \u201cImproved and fast extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique\u201d, Proc. of IEEE 6th Electronics Packaging Technology Conference (EPTC), pp. 510-515, December 2004.<\/li>\n<\/ol>\n

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      1. Third International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D), Best Interactive Poster Award: 2014\u5e748\u670828\u65e5<\/li>\n
      2. 7th Electronics Packaging Technology Conference (EPTC), Outstanding Student Paper Award: 2006\u5e7412\u67087\u65e5<\/li>\n<\/ol>\n

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        1. Teck Guan Lim, Ying Ying Lim, Yee Mong Khoo, Khan Oratti Kalandar Navas, Faxing Che, Ser Choong Chong, Soon Wee David Ho, Shan Gao, Rui Li, \u201cA wafer level package and a method of forming the same\u201d, SG183648A1, 2012\u5e749\u670827\u65e5<\/li>\n
        2. Ka Fai Chang , Yong Han, David Soon Wee Ho, Ying Ying Lim, \u201cSemiconductor package and method of forming the same\u201d, US 2020\/0185299 A1,2020\u5e746\u670811\u65e5<\/li>\n
        3. \u9752\u67f3\u660c\u5b8f,\u6a4b\u91ce\u5065,\u6797\u745b\u745b, \u4ef2\u5ddd\u535a\uff0c\u83ca\u5730\u514b\u5f25\uff0c\u201c\u5fae\u7d30\u91d1\u5c5e\u30d0\u30f3\u30d7\u306e\u5f62\u6210\u65b9\u6cd5\u53ca\u3073\u5fae\u7d30\u91d1\u5c5e\u30d0\u30f3\u30d7\u201d, JP.2020072114.A, \u7279\u958b2020-72114(P2020-72114A), \u516c\u958b\u65e52020\u5e745\u67087\u65e5<\/li>\n
        4. \n
          \u6a4b\u91ce \u5065, \u6797 \u745b\u745b, \u4ef2\u5ddd \u535a, \u9752\u67f3 \u660c\u5b8f, \u83ca\u5730 \u514b\u5f25, \u201c\u96fb\u5b50\u56de\u8def\u306e\u63a5\u7d9a\u65b9\u6cd5\u53ca\u3073\u96fb\u5b50\u56de\u8def\u201d ,WO2019-239909, \u516c\u958b\u65e5<\/span>2019\u5e7412\u670819\u65e5<\/p>\n<\/div>\n<\/li>\n<\/ol>\n","protected":false},"excerpt":{"rendered":"

          \u67fb\u8aad\u4ed8\u96d1\u8a8c\u3078\u306e\u6295\u7a3f\u8ad6\u6587 S Jimkeli Singh, Ying Ying Lim, Jehova Jire L Hmar, P Chinnamuthu, \u201cTemperature dependency on Ce-d … Continue Reading →<\/a><\/p>\n","protected":false},"author":126,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":"","_locale":"ja","_original_post":"http:\/\/grp.tcu.ac.jp\/flexelectronlab\/?p=29"},"categories":[6],"tags":[],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/posts\/29"}],"collection":[{"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/users\/126"}],"replies":[{"embeddable":true,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/comments?post=29"}],"version-history":[{"count":0,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/posts\/29\/revisions"}],"wp:attachment":[{"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/media?parent=29"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/categories?post=29"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/grp.tcu.ac.jp\/flexelectronlab\/wp-json\/wp\/v2\/tags?post=29"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}