Key publications

査読付雑誌への投稿論文

  1. S Jimkeli Singh, Ying Ying Lim, Jehova Jire L Hmar, P Chinnamuthu, “Temperature dependency on Ce-doped CuO nanoparticles: a comparative study via XRD line broadening analysis”, Appl. Phys. A, 128, 188 (2022); https://doi.org/10.1007/s00339-022-05334-1
  2. H. Manas Singh, Ying Ying Lim, P. Chinnamuthu, “Electrical and dielectric parameters in TiO2-NW/Ge-NW heterostructure MOS device synthesized by glancing angle deposition technique”,
    Sci. Rep, 11, 19837 (2021); https://doi.org/10.1038/s41598-021-99354-1
  3. Ying Ying Lim, Yuichi Kimura, Martial David Hardy, Shun Watanabe, Jun Takeya, “Thin and Flexible Printed Antenna Designed for Curved Metal Surfaces”, Flexible Printed Electron, 6(4), 045001 (2021); https://doi.org/10.1088/2058-8585/ac2989
  4. Shohei Kumagai, Akifumi Yamamura, Tatsuyuki Makita, Junto Tsurumi, Ying Ying Lim, Takahiro Wakimoto, Nobuaki Isahaya, Han Nozawa, Kayoko Sato, Masato Mitani, Toshihiro Okamoto, Shun Watanabe, Jun Takeya, “Scalable fabrication of organic single-crystalline wafers for reproducible TFT arrays”, Sci. Rep, 9, 15897, 1-8 (2019); https://doi.org/10.1038/s41598-019-50294-x
  5. Ying Ying Lim, Hiroshi Nakagawa, Masaru Hashino, Masahiro Aoyagi, Katsuya Kikuchi, “Hardness characteristics of Au cone-shaped bumps targeted for 3-D packaging applications” IEEE Trans. Compon. Packag. Manuf. Technol., 9(3), 419-426 (2019); 10.1109/TCPMT.2019.289323
  6. Ying Ying Lim, Yee Mey Goh, Manabu Yoshida, Tung Thanh Bui, Masahiro Aoyagi, Changqing Liu, “30-GHz high-frequency application of screen printed interconnects on an organic substrate”, IEEE Trans. Compon. Packag. Manuf. Technol., 7(9), 1506-1515 (2017); 10.1109/TCPMT.2017.2718023
  7. Ying Ying Lim, Yee Mey Goh, Changqing Liu, David Hutt, “Surface modification of an ambient UV-cured dielectric to realise electrically conducting traces”, Surf. Coat. Technol., 266, 93-104 (2015); https://doi.org/10.1016/j.surfcoat.2015.02.021
  8. Ying Ying Lim, Yee Mey Goh, Changqing Liu, “Surface treatments for inkjet printing onto a PTFE-based substrate for high frequency applications”, Ind. Eng. Chem. Res., 52 (33), 11564-11574 (2013); https://doi.org/10.1021/ie4006639
  9. Bangtao Chen, Vasarla Nagendra Sekhar, Cheng Jin, Ying Ying Lim, Justin See Toh, Sanchitha Fernando, Jaibir Sharma, “Low-loss broadband package platform with surface passivation and TSV for wafer-level packaging of RF-MEMS devices”, IEEE Trans. Compon. Packag. Manuf. Technol., 3(9), 1443 – 1452 (2013); 10.1109/TCPMT.2013.2263932
  10. Vempati Srinivas Rao, Vasarla Nagendra Sekhar, Ho Soon Wee, Ranjan Rajoo, Gaurav Sharma, Lim Ying Ying, Pinjala Damaruganath, “Process and reliability of embedded micro-wafer-level package (EMWLP) using low cure temperature dielectric material”, IEEE Trans. Compon. Packag. Manuf. Technol., 2(1), 13-22 (2012); 10.1109/TCPMT.2010.2104324
  11. Ying Ying Lim, Xianghua Xiao, Srinivasa Rao Vempati, Nandar Su, Aditya Kumar, Gaurav Sharma, Teck Guan Lim, Kripesh Vaidyanathan, Jinglin Shi, John H. Lau, Shiguo Liu, “High quality and low loss millimeter wave passives demonstrated to 77-GHz for SiP technologies using embedded wafer level packaging platform (EMWLP)”, IEEE Trans. Adv. Packag., 33 (4),1061-1071 (2010). 10.1109/TADVP.2010.2058849.
  12. Mihai Dragos Rotaru, Lim Ying Ying, Haridas Kuruveettil, Yang Rui, Alexander P. Popov, Chua Chee-Parng, “Implementation of packaged integrated antenna with embedded front end for bluetooth applications”, IEEE Trans. Adv. Packag., 31(3), 558-567 (2008); 10.1109/TADVP.2008.927840.
  13. Ying Ying Lim, Mihai Dragos Rotaru, Arokiaswami Alphones, Alexander P. Popov, “Simple and improved extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique”, IEE Proc. Microwaves, Antennas Propag., 152 (4), 214 – 220 (2005); 10.1049/ip-map:20045106.

査読付き国際会議

  1. Stacy A Lynrah, Rajshree Rajkumari, Ying Ying Lim, P Chinnamuthu,“Ultraviolet Induced Hydrophilicity of Metal Nanoparticles Decorated MnO2 NWs for Self-Cleaning Applications”,
    7th International Conference on Nanoscience and Nanotechnology (ICONN 2023), March 2023.
  2. 森本 遥, リム インイン,桐生 昭吾, “ヘルスケア用途を対象としたリッツ線のインダクタンス評価” ,  第37回エレクトロニクス実装学会春季講演大会, 2023.
  3. Ying Ying Lim, Masaru Hashino, Hiroshi Nakagawa, Masahiro Aoyagi, Katsuya Kikuchi, “Process evaluation of pyramidal and cone-shaped nanoparticle deposition (NPD) bumps using a thermally resistant resist”, Proc. of International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC), pp. 136-140, April 2018.
  4. Ying Ying Lim, Masahiro Aoyagi, Yee Mey Goh, Changqing Liu, “High frequency performance characterization of super-fine inkjet printed silver traces”, Proc. IEEE CPMT Symposium Japan (ICSJ), pp. 239-242, November 2016.
  5. Ying Ying Lim, Yee Mey Goh, Manabu Yoshida, Tung Thanh Bui, Tracey Vincent, Masahiro Aoyagi, Changqing Liu, “Silver screen printed transmission lines – Analyzing the influence of substrate roughness on the RF performance up to 30 GHz”, Proc. of IEEE 16th Electronics Packaging Technology Conference (EPTC), pp. 22-26, December 2014.
  6. Ying Ying Lim, Yee Mey Goh, Hiroki Tsuda, Jun Akedo, Masahiro Aoyagi and Changqing Liu, “Adhesion of aerosol deposition traces targeted for flexible electronics applications”, Proc. of the Third International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D), August 2014.
  7. Ying Ying Lim, Yee Mey Goh, Changqing Liu, “RF performance of inkjet and stencil printed traces for flexible electronics applications, Proc. of IEEE 14th Electronics Packaging Technology Conference (EPTC), pp. 556-562, December 2012
  8. Lim Ying Ying, David Ho Soon Wee, Kim Hyoung Joon, Pinjala Damaruganath, “Low cost characterization of the electrical properties of thin film and mold compound for embedded wafer level packaging (EMWLP)”, Proc. of IEEE 13th Electronics Packaging Technology Conference (EPTC), pp. 401-405, December 2011.
  9. Ying Ying Lim, Bangtao Chen, Aibin Yu, Jinglin Shi, “A broadband 3D package for RF MEMS devices utilizing through silicon vias (TSVs)”, Proc. of 16th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS), pp. 406-409, June 2011.
  10. Lim Ying Ying Lim, Ho Soon Wee David, Chong Ser Choong, Myo Ei Pa Pa, Lim Teck Guan, “A novel compact antenna with a low profile demonstrated on embedded wafer level packaging (EMWLP) technology”, Proc. of IEEE 61st Electronic Components and Technology Conference (ECTC), pp. 681-686, May-June 2011.
  11. Ying Ying Lim, Ranjan Rajoo, Ser Choong Chong, “Design and fabrication of embedded passives on thin flexible substrates and reliability evaluation of passives performance”, Proc. of IEEE 12th Electronics Packaging Technology Conference (EPTC), Singapore, pp. 681-686, December 2010.
  12. Ying Ying Lim, Aibin Yu, Bangtao Chen, “Wideband transitions for wafer level MEMS packages”, Proc. IEEE Electrical Design of Advanced Package & Systems Symposium (EDAPS), pp. 1-5, December 2010.
  13. Lim Ying Ying, Nandar Su, David Ho Soon Wee, Phyo Phyo Thaw, Orson Wang, Hijiri Kuriyama, Shun Yokotsuka, Kenichi Shirashi, “Millimeter wave dielectric characterization & demonstration of high-Q passives using a low loss thin film material”, Proc. of IEEE 11th Electronics Packaging Technology Conference (EPTC), pp. 518-523, December 2009.
  14. Ying Ying Lim, Srinivasa Rao Vempati, Nandar Su, Xianghua Xiao, Jinchang Zhou, Aditya Kumar, Phyo Phyo Thaw, Gaurav Sharma, Teck Guan Lim, Shiguo Liu, Kripesh Vaidyanathan, John H. Lau, “Demonstration of high quality and low loss millimeter wave passives on embedded wafer level packaging platform”, Proc. IEEE 59th Electronic Components and Technology Conference (ECTC), pp. 508-515, May 2009.
  15. Lim Ying Ying, Mihai Dragos Rotaru, “A compact and low cost multilayered balun designed for SiP applications”, Proc. of IEEE 8th Electronics Packaging Technology Conference (EPTC), pp. 82-84, December 2006.
  16. Lim Ying Ying, Mihai Dragos Rotaru, “An integrated and compact ISM bandpass filter using combline structures”, Proc. of IEEE 7th Electronics Packaging Technology Conference (EPTC), pp. 19-22, December 2005.
  17. Lim Ying Ying, Mihai Dragons Rotaru, Arokiaswami Alphones, Alexander P. Popov, Ranjan Rajoo, “A model for efficient and improved measurements of the complex permittivity of organic packaging materials using open-ended coaxial line technique”, Proc. of IEEE 7th Electronics Packaging Technology Conference (EPTC), pp. 421-426, December 2005.
  18. Lim Ying Ying, Mihai Dragons Rotaru, Arokiaswami Alphones, Alexander P. Popov and Ranjan Rajoo, “Improved and fast extraction of dielectric parameters of thin organic packaging materials using open-ended coaxial line technique”, Proc. of IEEE 6th Electronics Packaging Technology Conference (EPTC), pp. 510-515, December 2004.

受賞歴

  1. Third International Conference in Advanced Manufacturing for Multifunctional Miniaturised Devices (ICAM3D), Best Interactive Poster Award: 2014年8月28日
  2. 7th Electronics Packaging Technology Conference (EPTC), Outstanding Student Paper Award: 2006年12月7日

特許

  1. Teck Guan Lim, Ying Ying Lim, Yee Mong Khoo, Khan Oratti Kalandar Navas, Faxing Che, Ser Choong Chong, Soon Wee David Ho, Shan Gao, Rui Li, “A wafer level package and a method of forming the same”, SG183648A1, 2012年9月27日
  2. Ka Fai Chang , Yong Han, David Soon Wee Ho, Ying Ying Lim, “Semiconductor package and method of forming the same”, US 2020/0185299 A1,2020年6月11日
  3. 青柳昌宏,橋野健,林瑛瑛, 仲川博，菊地克弥，“微細金属バンプの形成方法及び微細金属バンプ”, JP.2020072114.A, 特開2020-72114(P2020-72114A), 公開日2020年5月7日
  4. 橋野 健, 林 瑛瑛, 仲川 博, 青柳 昌宏, 菊地 克弥, “電子回路の接続方法及び電子回路” ,WO2019-239909, 公開日2019年12月19日

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